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Full Schedule
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Tue, Feb 24
Wed, Feb 25
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Fri, Feb 27
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Full Schedule
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Tuesday, February 24, 2026
7:00am - 6:30pm
MT
Registration
7:00am - 6:30pm
MT
Registration
Location: Sun Lounge in the Wigwam Lobby
8:00am - 5:00pm
MT
FLEX 2026 Courses
FLEX Courses
8:00am - 5:00pm
MT
FLEX 2026 Courses
FLEX Courses
8:00am - 5:00pm
MT
Advanced Packaging: Additive Processing & Manufacturing, Heterogeneous Integration for the AI Era, and More
Location: Sachem West
Speaker:
Terry Alford, PhD
– Arizona State University
FLEX Courses
9:00am - 12:00pm
MT
Advancing Printed Electronics Technology: From Macroelectronics to Quantum Devices
Location: Sachem East
Speaker:
J. Devin MacKenzie
– University of Washington
FLEX Courses
1:30pm - 4:30pm
MT
Digital Twins for Printed Electronics: How Can AI Learn FHE Printing?
Location: Sachem East
Speaker:
Benyamin Davaji
– Northeastern University
Speaker:
Haiyang Yun
– Northeastern University
FLEX Courses
8:30am - 12:00pm
MT
FHE Gap Analysis
Gap Analysis
8:30am - 12:00pm
MT
FHE Gap Analysis
Location: Kiva Room
Gap Analysis
8:30am - 8:40am
MT
Welcome Remarks
Location: Kiva Room
Session Chair:
Gity Samadi
– SEMI
Gap Analysis
8:40am - 9:00am
MT
Agile System Integration for Soft Robotics: Lessons from the Cogniworm Project
Location: Kiva Room
Speaker:
Deepak Trivedi, n/a
– GE Aerospace
Gap Analysis
9:00am - 9:20am
MT
High Resolution Multi-Layer Printing for Flexible System in Package (FLYSIP)
Location: Kiva Room
Co-Presenter:
Henry Lei
– NoiseFigure Research
Co-Presenter:
Manish Ojha
– NoiseFigure Research
Gap Analysis
9:20am - 11:55am
MT
FHE Gap Analysis Round Table Discussion
Location: Kiva Room
Gap Analysis
11:55am - 12:00pm
MT
FHE Gap Analysis Closing Remarks
Location: Kiva Room
Session Chair:
Gity Samadi
– SEMI
Gap Analysis
12:00pm - 1:30pm
MT
Networking Lunch
12:00pm - 1:30pm
MT
Networking Lunch
Location: Sachem Terrace
Networking
12:00pm - 6:30pm
MT
Exhibits
12:00pm - 6:30pm
MT
Connect with Solution Providers
Location: Solution Zone, Mohave Ballroom
1:30pm - 5:00pm
MT
NBMC Gap Analysis
Gap Analysis
1:30pm - 5:00pm
MT
NBMC Gap Analysis
Location: Kiva Room
Gap Analysis
1:30pm - 1:40pm
MT
Welcome Remarks
Location: Kiva Room
Session Chair:
Gity Samadi
– SEMI
Gap Analysis
1:40pm - 2:00pm
MT
Toward Scalable & Wearable Biosensors with Automated Blood Collection and Integrated GFET Detection
Location: Kiva Room
Speaker:
Michael Moniz, n/a
– Satio Inc.
Gap Analysis
2:00pm - 2:20pm
MT
AI-Enhanced Graphene Transistors for Next-Gen Medical Diagnostics
Location: Kiva Room
Speaker:
Jesus de la Fuente
– Graphenea Inc.
Gap Analysis
2:20pm - 4:55pm
MT
NBMC Gap Analysis Round Table Discussion
Location: Kiva Room
Gap Analysis
4:55pm - 5:00pm
MT
NBMC Gap Analysis Closing Remarks
Location: Kiva Room
Session Chair:
Gity Samadi
– SEMI
Gap Analysis
5:00pm - 6:30pm
MT
Networking Welcome Reception
5:00pm - 6:30pm
MT
Networking Welcome Reception
Location: Solution Zone, Mohave Ballroom
Networking
Wednesday, February 25, 2026
7:00am - 8:00am
MT
Breakfast
7:00am - 8:00am
MT
Continental Breakfast
Location: Solution Zone, Mohave Ballroom
7:00am - 4:00pm
MT
Exhibits
7:00am - 4:00pm
MT
Connect with Solution Providers
Location: Solution Zone, Mohave Ballroom
7:00am - 6:30pm
MT
Registration
7:00am - 6:30pm
MT
Registration
Location: Wigwam Foyer
8:00am - 9:45am
MT
SESSION 1: KEYNOTES – General Session
Session Chair:
Melissa Grupen-Shemansky
– SEMI
Keynote
8:00am - 9:45am
MT
SESSION 1: KEYNOTES – General Session
Location: Hopi
Session Chair:
Melissa Grupen-Shemansky
– SEMI
Keynote
8:00am - 8:10am
MT
Welcome Remarks
Location: Hopi
Session Chair:
Melissa Grupen-Shemansky
– SEMI
Keynote
8:10am - 8:40am
MT
Flexible Bioelectronics – From Exploratory Research to Medical Translation
Location: Hopi
Keynote Speaker:
John A. Rogers
– Northwestern University
Keynote
8:40am - 9:10am
MT
Will Embodied AI Create Robotic Coworkers?
Location: Hopi
Keynote Speaker:
Ani Kelkar, PhD
– McKinsey & Company, Inc.
Keynote
9:10am - 9:40am
MT
InnovaFlex Foundry: The Journey of a US Semiconductor Fab
Location: Hopi
Keynote Speaker:
Lindsay Pack Moll
– InnovaFlex Foundry
Keynote
9:40am - 9:45am
MT
Closing Remarks
Location: Hopi
Session Chair:
Melissa Grupen-Shemansky
– SEMI
Keynote
9:45am - 10:30am
MT
Student Poster Networking Break
9:45am - 10:30am
MT
Student Poster Networking Break
Location: Solution Zone, Mohave Ballroom
Networking
10:30am - 12:15pm
MT
SESSION 2: Additive Manufacturing of Electronics
Session Chair:
Mark D. Poliks
– Binghamton University, State University of New York
Advanced 3D Manufacturing
10:30am - 12:15pm
MT
SESSION 2: Additive Manufacturing of Electronics
Location: Hopi
Session Chair:
Mark D. Poliks
– Binghamton University, State University of New York
Advanced 3D Manufacturing
10:35am - 10:55am
MT
Packaging Challenges Using Ultra Fine Aerosol Printing for High Density Vertical Interconnects
Location: Hopi
Speaker:
Stephen Barnes
– Integrated Deposition Solutions, Inc. (IDS)
Additive Manufacturing
10:55am - 11:15am
MT
Additive Manufacturing of Trace, Passive and Active Components for 3D HI and Advanced Packaging
Location: Hopi
Speaker:
Ahmed Busnaina
– Nano OP, Inc. and Northeastern University
Additive Manufacturing
11:15am - 11:35am
MT
Micro and Nanoscale Additive Manufacturing for Electronics Packaging Applications
Location: Hopi
Speaker:
Michael Arthur Cullinan
– The University of Texas at Austin
Additive Manufacturing
11:35am - 11:55am
MT
Electrochemical Additive Manufacturing: Redefining Metal Manufacturing for Next-Generation Electronics
Location: Hopi
Speaker:
Michael C. Matthews
– Fabric8Labs
Additive Manufacturing
11:55am - 12:15pm
MT
10 Years of Flexible Hybrid Electronics: A Team-based Journey to Technology Transition Success
Location: Hopi
Speaker:
Paul Gaylo
– Lockheed Martin RMS
Additive Manufacturing
10:30am - 12:15pm
MT
SESSION 3: Flexible Display Technology & Applications
Session Chair:
Michael D. McCreary, PhD
– E Ink
Flexible Display Technology & Applications
10:30am - 12:15pm
MT
SESSION 3: Flexible Display Technology & Applications
Location: Aztec
Session Chair:
Michael D. McCreary, PhD
– E Ink
Flexible Display Technology & Applications
10:35am - 10:55am
MT
Organic Thin-Film Transistors Are Here – From Flexible ePaper Displays to Pixelated Dimmers for AR Glasses
Location: Aztec
Speaker:
Paul Cain
– FlexEnable Technology Ltd.
Flexible Display Technology & Applications
10:55am - 11:15am
MT
Flexible Front Planes: Enabling Foldable, Rollable, and Stretchable Form Factors
Location: Aztec
Speaker:
Bryan Chan
– E Ink
Flexible Display Technology & Applications
11:15am - 11:35am
MT
Color Changing Cars: From Small Ideas to Big Innovations
Location: Aztec
Speaker:
Etienne Iliffe-Moon
– BMW Group Technology Office USA
Flexible Display Technology & Applications
11:35am - 11:55am
MT
Sustainable, Vacuum-Free Manufacturing of Flexible E-Paper Backplanes Using Printed OTFT Technology
Location: Aztec
Speaker:
Yasunori Takeda
– Yamagata University
Flexible Display Technology & Applications
11:55am - 12:15pm
MT
Advanced Laser Processes for Flexible Display Manufacturing
Location: Aztec
Speaker:
Qiongying Hu
– Coherent Corp.
Flexible Display Technology & Applications
12:15pm - 1:45pm
MT
Networking Lunch
12:15pm - 1:45pm
MT
Networking Lunch
Location: Solution Zone, Mohave Ballroom
Networking
1:45pm - 3:10pm
MT
SESSION 4: Bridging the Gap: Interface & Packaging Innovations in FHE
Session Chair:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Flexible Hybrid Electronics
1:45pm - 3:10pm
MT
SESSION 4: Bridging the Gap: Interface & Packaging Innovations in FHE
Location: Hopi
Session Chair:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Flexible Hybrid Electronics
1:50pm - 2:10pm
MT
Printed FHE Sensors for Integrated Functionality onto Aerospace Inspection Platforms
Location: Hopi
Speaker:
Felippe Pavinatto
– GE Aerospace
Flexible Hybrid Electronics
2:10pm - 2:30pm
MT
Wireless Interstitial Fluid Monitoring Patches for Stress Assessment
Location: Hopi
Speaker:
Azar Alizadeh
– GE HealthCare Technology & Innovation Center
Flexible Hybrid Electronics
2:30pm - 2:50pm
MT
Advanced Packaging for Mechanically Compliant Liquid Metal Electronics
Location: Hopi
Speaker:
Christopher Tabor
– Air Force Research Laboratory
Flexible Hybrid Electronics
2:50pm - 3:10pm
MT
How Superior Functional Materials Enable Fully Additive Manufacture of Durable FHE and e-textiles
Location: Hopi
Speaker:
Michael A. Mastropietro
– ACI Materials
Flexible Hybrid Electronics
1:45pm - 3:10pm
MT
SESSION 5: Digital Twins
Session Chair:
Christopher J. Bailey
– Arizona State University
Digital Twins
1:45pm - 3:10pm
MT
SESSION 5: Digital Twins
Location: Aztec
Session Chair:
Christopher J. Bailey
– Arizona State University
Digital Twins
1:50pm - 2:10pm
MT
Toward Intelligent Packaging: Predictive Interconnect Testing with Digital Twins and SLM Integration
Location: Aztec
Speaker:
Partho Bhoumik
– Arizona State University
Digital Twins
2:10pm - 2:30pm
MT
Federated Learning and Digital Twins for Accelerating Innovation in Electronics
Location: Aztec
Speaker:
Benyamin Davaji
– Northeastern University
Digital Twins
2:30pm - 2:50pm
MT
Digital Twin–Enabled Domain-Specific LLM for Flexible Hybrid Electronics R&D
Location: Aztec
Speaker:
Jiaojiao Li
– Object Tech, Inc
Digital Twins
2:50pm - 3:10pm
MT
Digital Twins for Electronics Facilities: Laser Scanning, BIM, and GIS from Build to Ops
Location: Aztec
Speaker:
Drew Seward
– Surveying And Mapping, LLC (SAM)
Digital Twins
3:10pm - 4:00pm
MT
Student Poster Networking Break
3:10pm - 4:00pm
MT
Student Poster Networking Break
Location: Solution Zone, Mohave Ballroom
Networking
4:00pm - 5:30pm
MT
SESSION 6: Technology Disruptors + Opportunities
Session Chair:
Douglas E. Kiehl
– Purdue University
Technology Disruptors + Opportunities
4:00pm - 5:30pm
MT
SESSION 6: Technology Disruptors + Opportunities
Location: Hopi
Session Chair:
Douglas E. Kiehl
– Purdue University
Technology Disruptors + Opportunities
4:05pm - 4:25pm
MT
SESSION 6: Neural Edge TBA
Location: Hopi
Speaker:
Sean Kelly
– Neural Edge
Technology Disruptors + Opportunities
4:25pm - 4:45pm
MT
Agentic AI Digital Twins: the Operating System for Next-Generation Semiconductor Manufacturing?
Location: Hopi
Speaker:
Dan Isaacs
– Digital Twin Consortium
Technology Disruptors + Opportunities
4:45pm - 5:05pm
MT
Accelerating Innovation in the Age of Digital Engineering
Location: Hopi
Speaker:
Marc Horner
– Synopsys
Technology Disruptors + Opportunities
5:05pm - 5:25pm
MT
Honeywell CFX for Semiconductor PFAS Waste Destruction
Location: Hopi
Speaker:
Shawn S. Tanagho, n/a
– Honeywell
Technology Disruptors+Opportunities
5:25pm - 5:30pm
MT
Closing Remarks
Location: Hopi
Session Chair:
Douglas E. Kiehl
– Purdue University
Technology Disruptors + Opportunities
4:00pm - 5:30pm
MT
SESSION 7: Printed Electronics
Session Chair:
Carolyn Ellinger
– Eastman Kodak Company
Printed Electronics
4:00pm - 5:30pm
MT
SESSION 7: Printed Electronics
Location: Aztec
Session Chair:
Carolyn Ellinger
– Eastman Kodak Company
Printed Electronics
4:05pm - 4:25pm
MT
Flexographically Printed OLEDs
Location: Aztec
Speaker:
Whitney Gaynor
– Sinovia Technologies
Printed Electronics
4:25pm - 4:45pm
MT
Contamination: Find It, Fix It, Prevent It
Location: Aztec
Speaker:
Joe Kotwis
– Web Handling Insights LLC
Printed Electronics
4:45pm - 5:05pm
MT
New Developments in Polyimide Films for Advanced Flexible Electronics
Location: Aztec
Speaker:
Zak Eckel
– Arkema, Inc.
Printed Electronics
5:05pm - 5:25pm
MT
Microadditive Manufacturing: A Quantum Leap in FHE Modules up to Sub-THz Frequencies
Location: Aztec
Speaker:
Emmanouil M. Tentzeris
– Georgia Institute of Technology
Printed Electronics
5:25pm - 5:30pm
MT
Closing Remarks
Location: Aztec
Session Chair:
Carolyn Ellinger
– Eastman Kodak Company
Printed Electronics
5:30pm - 7:00pm
MT
FLEXI and Student Poster Awards Reception
5:30pm - 7:00pm
MT
FLEXI and Student Poster Awards Reception
Location: Sachem Terrace
Thursday, February 26, 2026
7:00am - 8:00am
MT
Breakfast
7:00am - 8:00am
MT
Continental Breakfast
Location: Sachem Terrace
7:00am - 1:45pm
MT
Registration
7:00am - 1:45pm
MT
Registration
Location: Wigwam Foyer
8:00am - 9:45am
MT
SESSION 8: KEYNOTES – General Session
Session Chair:
Gity Samadi
– SEMI
Session Chair:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Keynote
8:00am - 9:45am
MT
SESSION 8: KEYNOTES – General Session
Location: Hopi
Session Chair:
Gity Samadi
– SEMI
Session Chair:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Keynote
8:00am - 8:10am
MT
Opening Remarks
Location: Hopi
Session Chair:
Gity Samadi
– SEMI
Session Chair:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Keynote
8:10am - 8:40am
MT
Flexible ePaper Displays: From University Research to Global Corporation
Location: Hopi
Keynote Speaker:
Michael D. McCreary, PhD
– E Ink
Keynote
8:40am - 9:10am
MT
Wearable Microfluidic Systems for Personalized Hydration and Health Management
Location: Hopi
Keynote Speaker:
Roozbeh Ghaffari
– Epicore Biosystems, Inc.
Keynote
9:40am - 9:45am
MT
Closing Remarks
Location: Hopi
Session Chair:
Gity Samadi
– SEMI
Session Chair:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Keynote
9:45am - 10:30am
MT
Networking Break
9:45am - 10:30am
MT
Networking Break
Location: Wigwam Foyer
Networking
10:30am - 12:15pm
MT
SESSION 9: Flexible Hybrid Electronics: Toward Scalable, Sustainable Systems
Session Chair:
Christine Kallmayer
– Fraunhofer - IZM
Flexible Hybrid Electronics
10:30am - 12:15pm
MT
SESSION 9: Flexible Hybrid Electronics: Toward Scalable, Sustainable Systems
Location: Hopi
Session Chair:
Christine Kallmayer
– Fraunhofer - IZM
Flexible Hybrid Electronics
10:35am - 10:55am
MT
The Value of Transparency for Automotive Heater & Antenna Applications: Identifying Product Market Fit
Location: Hopi
Speaker:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Flexible Hybrid Electronics
10:55am - 11:15am
MT
Failure Mechanics of FHE Circuits under Sustained Temperature and Stresses of Daily Motion
Location: Hopi
Speaker:
Pradeep Lall
– Auburn University
Flexible Hybrid Electronics
11:15am - 11:35am
MT
High Resolution, Multi-layered Screen-printing of Stretchable Circuitry with ELMNT Liquid Metal
Location: Hopi
Speaker:
Jack T. Ly
– BlueHalo, an AV company
Flexible Hybrid Electronics
11:35am - 11:55am
MT
Investigating Organic Thin-Film Transistors for Particulate Matter (PM) Sensing Applications
Location: Hopi
Speaker:
Wudyalew Wondmagegn
– The College of New Jersey
Flexible Hybrid Electronics
11:55am - 12:15pm
MT
Tekscan’s Flexible, Sensorized Tactical Glove: Positioning of Bend and Applied Force
Location: Hopi
Speaker:
Casey J. Grenier, Ph. D.
– Tekscan, Inc
Flexible Hybrid Electronics
10:30am - 12:15pm
MT
SESSION 10: Defense & Harsh Environment Applications
Session Chair:
Andres Bujanda
Defense and Harsh Environment Applications
10:30am - 12:15pm
MT
SESSION 10: Defense & Harsh Environment Applications
Location: Aztec
Session Chair:
Andres Bujanda
Defense and Harsh Environment Applications
10:35am - 10:55am
MT
Low Swap_C Additively Packaged MEMS IMU
Location: Aztec
Speaker:
David Lin
– GE Aerospace Research
Defense and Harsh Environment Applications
10:55am - 11:15am
MT
Additively Manufactured Packages for Harsh Environment Electronics
Location: Aztec
Speaker:
Michael S. Kranz
– EngeniusMicro, LLC
Defense and Harsh Environment Applications
11:15am - 11:35am
MT
Novel Ink Development, Characterization, and Tests for Harsh Environments
Location: Aztec
Speaker:
Richard L. Fink
– Applied Nanotech Inc.
Defense and Harsh Environment Applications
11:35am - 11:55am
MT
Advances in EIT Sensor Systems for Non-Destructive Testing with Soft Robots
Location: Aztec
Speaker:
Madhu Stemmermann
– SunRay Scientific Inc.
Defense and Harsh Environment Applications
11:55am - 12:15pm
MT
Advanced Materials and Flexible Hybrid Electronics for Harsh Environments
Location: Aztec
Speaker:
Shenqiang (Shen) Ren
– University of Maryland College Park
Defense and Harsh Environment Applications
12:15pm - 1:45pm
MT
Networking Lunch
12:15pm - 1:45pm
MT
Networking Lunch
Location: Sachem Terrace
Networking
1:45pm - 3:10pm
MT
SESSION 11: Connected Health & Human Performance: The Future of Wearable Medical Technologies & IoT Integration
Session Chair:
Stephaney Shanks
– AV, Inc.
Session Chair:
Simon Dodd
– STMicroelectronics
Wearable + Medical Electronics
1:45pm - 3:10pm
MT
SESSION 11: Connected Health & Human Performance: The Future of Wearable Medical Technologies & IoT Integration
Location: Hopi
Session Chair:
Stephaney Shanks
– AV, Inc.
Session Chair:
Simon Dodd
– STMicroelectronics
Wearable + Medical Electronics
1:50pm - 2:10pm
MT
Microneedle-Based Wearable Biosensing for Advanced Physiological Monitoring
Location: Hopi
Speaker:
Ronen Polsky
– Biowear
Wearable & Medical Electronics
2:10pm - 2:30pm
MT
Advanced Flexible Wearable Sensors for Clinical Medicine, Military, and Digital Health Applications
Location: Hopi
Speaker:
Steve Xu
– Sibel Health
Wearable & Medical Electronics
2:30pm - 2:50pm
MT
Next Generation, Wearable and Field-Deployable Sensors for Applications in Medicine, Environmental Monitoring, and Intelligence Gathering
Location: Hopi
Speaker:
Amay J. Bandodkar
– North Carolina State University
Wearable & Medical Electronics
2:50pm - 3:10pm
MT
Wearable Ultrasound Technology
Location: Hopi
Speaker:
Sheng Xu
– Stanford University
Wearable & Medical Electronics
1:45pm - 3:10pm
MT
SESSION 12: Advanced Packaging & Heterogeneous Integration
Session Chair:
Mark D. Poliks
– Binghamton University, State University of New York
Advanced Packaging
1:45pm - 3:10pm
MT
SESSION 12: Advanced Packaging & Heterogeneous Integration
Location: Aztec
Session Chair:
Mark D. Poliks
– Binghamton University, State University of New York
Advanced Packaging
1:50pm - 2:10pm
MT
SESSION 12: Intel TBA
Location: Aztec
Speaker:
Ravi Mahajan, PhD
– Intel
Advanced Packaging
2:10pm - 2:30pm
MT
Next Generation Advanced Packaging Challenges: Consumer vs. Data Center
Location: Aztec
Speaker:
E. Jan Vardaman
– TechSearch International, Inc.
Advanced Packaging
2:30pm - 2:50pm
MT
Process Planning Approach for Hybrid Additive Manufacturing of Complex 3D Structural Electronics
Location: Aztec
Speaker:
Ashish Jacob, n/a
– The Pennsylvania State University
Advanced Packaging
2:50pm - 3:10pm
MT
Indium Bump Interconnect (IBI) Flip Chip Bonding
Location: Aztec
Speaker:
Dmitry Padrubny
– Finetech USA
Advanced Packaging
3:10pm - 4:00pm
MT
Networking Break
3:10pm - 4:00pm
MT
Networking Break
Location: Wigwam Foyer
Networking
4:00pm - 5:30pm
MT
SESSION 13: Printed Electronics
Session Chair:
Felippe Pavinatto
– GE Aerospace
Printed Electronics
4:00pm - 5:30pm
MT
SESSION 13: Printed Electronics
Location: Hopi
Session Chair:
Felippe Pavinatto
– GE Aerospace
Printed Electronics
4:05pm - 4:25pm
MT
SESSION 13: University of Washington TBA
Location: Hopi
Speaker:
J. Devin MacKenzie
– University of Washington
Printed Electronics
4:25pm - 4:45pm
MT
Establishing Novel Thick- and Ultra-Thin-Film Flexible Printed Circuits via Additive Inkjet & Electroplating: Elephantech’s Breakthrough in SustainaCircuits™
Location: Hopi
Speaker:
Nobuhiko Okamoto
– Elephantech Inc
Printed Electronics
4:45pm - 5:05pm
MT
Additive Manufacturing Technologies for Next Generation Microelectronics and Packaging
Location: Hopi
Speaker:
Hylke B. Akkerman
– Holst Centre / TNO
Printed Electronics
5:05pm - 5:25pm
MT
Inkless and AI-Enabled Additive Nanomanufacturing of Functional Materials and Devices
Location: Hopi
Speaker:
Masoud Mahjouri-Samani
– NanoPrintek, Inc.
Printed Electronics
5:25pm - 5:30pm
MT
Conference Closing
Location: Hopi
Session Chair:
Felippe Pavinatto
– GE Aerospace
Printed Electronics
4:00pm - 5:30pm
MT
SESSION 14: Energy Storage & Efficiency
Session Chair:
Dylan Shah
– Arieca
Energy Storage & Efficiency
4:00pm - 5:30pm
MT
SESSION 14: Energy Storage & Efficiency
Location: Aztec
Session Chair:
Dylan Shah
– Arieca
Energy Storage & Efficiency
4:05pm - 4:25pm
MT
How Much Energy Can Wearables Harvest Per Day? A Data-Driven Analysis with Flexible Multi-Modal Harvesters
Location: Aztec
Speaker:
Umit Ogras
– University of Wisconsin–Madison
Energy Storage & Efficiency
4:25pm - 4:45pm
MT
Design Principles for Flexible Power Sources
Location: Aztec
Speaker:
Candace K. Chan
– Arizona State University
Energy Storage & Efficiency
4:45pm - 5:05pm
MT
Low-Power ZnON Thin-Film Transistors for Neuromorphic-Photodetector Switching with PCB Integration
Location: Aztec
Speaker:
Won Woo Lee
– Hanyang University
Energy Storage & Efficiency
5:05pm - 5:25pm
MT
Plan to be Wrong: A Case Study in Scaling Flexible Photovoltaics
Location: Aztec
Speaker:
Richard Swartwout
– Active Surfaces Inc.
Energy Storage & Efficiency
5:25pm - 5:30pm
MT
Conference Closing
Location: Aztec
Session Chair:
Dylan Shah
– Arieca
Energy Storage & Efficiency
Friday, February 27, 2026
9:00am - 11:00am
MT
Arizona State University Macro Technology Works [MTW] Tour
9:00am - 11:00am
MT
Arizona State University Macro Technology Works [MTW] Tour
Tours
9:00am - 11:00am
MT
Mayo Clinic College of Medicine and Science Tour
9:00am - 11:00am
MT
Mayo Clinic College of Medicine and Science Tour
Tours
9:00am - 11:00am
MT
Medtronic Tour
9:00am - 11:00am
MT
Medtronic Tour
Tours
Student Posters
8:00am - 5:00pm
MT
Student Posters
Student Posters
8:00am - 5:00pm
MT
Student Posters
Location: Wigwam Foyer
Student Posters
8:00am - 5:00pm
MT
Additively Manufactured Low Loss Dielectric Films for RF and Microwave Applications
Location: Wigwam Foyer
Student:
Morgan Michael
– UMass Lowell/Raytheon UML Research Institute
Student Posters
8:00am - 5:00pm
MT
Development of an X-Band Frequency Selective Surface for Electromagnetic Interference Shielding
Location: Wigwam Foyer
Student:
Daniel D. Bousquet
– University of Massachusetts Lowell
Student Posters
8:00am - 5:00pm
MT
Digital Twin for Predicting Structural and Electrical Properties of Printed FHE devices
Location: Wigwam Foyer
Student:
Haiyang Yun
– Northeastern University
Student Posters
8:00am - 5:00pm
MT
Multifunctional MXene PVBVA e-tattoos for Sensing, Energy Harvesting, and Charge Storage.
Location: Wigwam Foyer
Student:
Ajay Pratap
– Boise State University
Student Posters
8:00am - 5:00pm
MT
Plasma-Jet Printing for Self-Sintered and Multi-Material Deposition of Films
Location: Wigwam Foyer
Student:
Lakshmi Prakasan, n/a
– Oregon State University
Student Posters
8:00am - 5:00pm
MT
Printable Copper Ink Materials for Flexible Hybrid Electronics
Location: Wigwam Foyer
Student:
Dennis Zhao
– University of Maryland College Park
Student Posters
8:00am - 5:00pm
MT
Programmable and Scalable Embroidery Textile Resistive Sensors for Integrated Wearable Systems
Location: Wigwam Foyer
Student:
Yiduo Yang
– North Carolina State University
Student Posters
8:00am - 5:00pm
MT
Screen Printed Silver Gated Amorphous IGZO TFT for Biosensing Platform
Location: Wigwam Foyer
Student:
Sunil Suresh Domala
– Indian Institute of Technology Bombay Mumbai India
Student Posters
8:00am - 5:00pm
MT
Ultra-High Temperature Preceramic Polymers for Additive Manufacturing
Location: Wigwam Foyer
Student:
Nicholas D. Meuse
– University of Maryland College Park
Student Posters
