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Full Schedule
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Tue, Feb 24
Wed, Feb 25
Thu, Feb 26
Full Schedule
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Tuesday, February 24, 2026
7:00am - 6:30pm
MT
Registration
7:00am - 6:30pm
MT
Registration
8:30am - 12:00pm
MT
FHE Gap Analysis
Gap Analysis
8:30am - 12:00pm
MT
FHE Gap Analysis
Gap Analysis
12:00pm - 1:30pm
MT
Networking Lunch
12:00pm - 1:30pm
MT
Networking Lunch
Networking
12:00pm - 6:30pm
MT
Exhibits
12:00pm - 6:30pm
MT
Connect with Solution Providers
Location: Solution Zone
1:30pm - 5:00pm
MT
NBMC Gap Analysis
Gap Analysis
1:30pm - 5:00pm
MT
NBMC Gap Analysis
Gap Analysis
5:00pm - 6:30pm
MT
Networking Welcome Reception
5:00pm - 6:30pm
MT
Networking Welcome Reception
Location: Exhibit Hall
Networking
Wednesday, February 25, 2026
7:00am - 4:00pm
MT
Exhibits
7:00am - 4:00pm
MT
Connect with Solution Providers
Location: Solution Zone
7:00am - 6:30pm
MT
Registration
7:00am - 6:30pm
MT
Registration
8:00am - 9:45am
MT
SESSION 1: KEYNOTES – General Session
Session Chair:
Melissa Grupen-Shemansky
– SEMI
Keynote
8:00am - 9:45am
MT
SESSION 1: KEYNOTES – General Session
Session Chair:
Melissa Grupen-Shemansky
– SEMI
Keynote
8:10am - 8:40am
MT
SESSION 1: KEYNOTE – Flexible Bioelectronics – From Exploratory Research to Medical Translation
Keynote Speaker:
John A. Rogers
– Northwestern University
Keynote
8:40am - 9:10am
MT
SESSION 1: KEYNOTE – Will Embodied AI Create Robotic Coworkers?
Keynote Speaker:
Ani Kelkar, PhD
– McKinsey & Company, Inc.
Keynote
9:45am - 10:30am
MT
Student Poster Networking Break
9:45am - 10:30am
MT
Student Poster Networking Break
Location: Exhibit Hall
Networking
10:30am - 12:15pm
MT
SESSION 2: Additive Manufacturing of Electronics
Session Chair:
Mark D. Poliks
– Binghamton University, State University of New York
Advanced 3D Manufacturing
10:30am - 12:15pm
MT
SESSION 2: Additive Manufacturing of Electronics
Session Chair:
Mark D. Poliks
– Binghamton University, State University of New York
Advanced 3D Manufacturing
10:35am - 10:55am
MT
Packaging Challenges Using Ultra Fine Aerosol Printing for High Density Vertical Interconnects
Speaker:
Stephen Barnes
– Integrated Deposition Solutions, Inc. (IDS)
10:30am - 12:15pm
MT
SESSION 3: Flexible Display Technology & Applications
Session Chair:
Michael D. McCreary, PhD
– E Ink
Flexible Display Technology & Applications
10:30am - 12:15pm
MT
SESSION 3: Flexible Display Technology & Applications
Session Chair:
Michael D. McCreary, PhD
– E Ink
Flexible Display Technology & Applications
10:35am - 10:55am
MT
Organic Thin-Film Transistors Are Here – From Flexible ePaper Displays to Pixelated Dimmers for AR Glasses
Speaker:
Paul Cain
– FlexEnable Technology Ltd.
10:55am - 11:15am
MT
Flexible Electrophoretic Displays and Applications
Speaker:
Bryan Chan
– E Ink
12:15pm - 1:45pm
MT
Networking Lunch
12:15pm - 1:45pm
MT
Networking Lunch
Location: Exhibit Hall
Networking
1:45pm - 3:10pm
MT
SESSION 4: Bridging the Gap: Interface & Packaging Innovations in FHE
Session Chair:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Interface & Packaging Innovations
1:45pm - 3:10pm
MT
SESSION 4: Bridging the Gap: Interface & Packaging Innovations in FHE
Session Chair:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Interface & Packaging Innovations
1:50pm - 2:10pm
MT
SESSION 4: GE Aerospace TBA
Speaker:
Felippe Pavinatto
– GE Aerospace
A
2:10pm - 2:30pm
MT
SESSION 4: Wireless Interstitial Fluid Monitoring Patches for Stress Assessment
Speaker:
Azar Alizadeh
– GE HealthCare Technology & Innovation Center
A
2:30pm - 2:50pm
MT
SESSION 4: Air Force Research Laboratory TBA
Speaker:
Christopher Tabor
– Air Force Research Laboratory
A
1:45pm - 3:10pm
MT
SESSION 5: Digital Twins
Session Chair:
Christopher Bailey
– Arizona State University
Digital Twins
1:45pm - 3:10pm
MT
SESSION 5: Digital Twins
Session Chair:
Christopher Bailey
– Arizona State University
Digital Twins
3:10pm - 4:00pm
MT
Student Poster Networking Break
3:10pm - 4:00pm
MT
Student Poster Networking Break
Location: Exhibit Hall
Networking
4:00pm - 5:30pm
MT
SESSION 6: Technology Disruptors + Opportunities
Technology Disruptors + Opportunities
4:00pm - 5:30pm
MT
SESSION 6: Technology Disruptors + Opportunities
Technology Disruptors + Opportunities
4:05pm - 4:25pm
MT
SESSION 6: Neural Edge TBA
Speaker:
Sean Kelly
– Neural Edge
Technology Disruptors + Opportunities
4:25pm - 4:45pm
MT
SESSION 6: Digital Twin Consortium TBA
Speaker:
Dan Isaacs
– Digital Twin Consortium
Technology Disruptors + Opportunities
4:45pm - 5:05pm
MT
SESSION 6: Synopsys TBA
Speaker:
Marc Horner, PhD
– Synopsys
Technology Disruptors + Opportunities
4:00pm - 5:30pm
MT
SESSION 7: Printed Electronics
Session Chair:
Carolyn Ellinger
– Eastman Kodak Company
Printed Electronics
4:00pm - 5:30pm
MT
SESSION 7: Printed Electronics
Session Chair:
Carolyn Ellinger
– Eastman Kodak Company
Printed Electronics
4:05pm - 4:25pm
MT
SESSION 7: Sinovia Technologies TBA
Speaker:
Whitney Gaynor
– Sinovia Technologies
Printed Electronics
5:30pm - 6:30pm
MT
FLEXI and Student Poster Awards Reception
5:30pm - 6:30pm
MT
FLEXI and Student Poster Awards Reception
Networking
Thursday, February 26, 2026
7:00am - 1:45pm
MT
Registration
7:00am - 1:45pm
MT
Registration
8:00am - 9:45am
MT
SESSION 8: KEYNOTES – General Session
Keynote
8:00am - 9:45am
MT
SESSION 8: KEYNOTES – General Session
Keynote
8:10am - 8:40am
MT
Flexible ePaper Displays: From University Research to Global Corporation
Keynote Speaker:
Michael D. McCreary, PhD
– E Ink
Keynote
9:45am - 10:30am
MT
Networking Break
9:45am - 10:30am
MT
Networking Break
Networking
10:30am - 12:15pm
MT
SESSION 10: Defense & Harsh Environment Applications
Defense and Harsh Environment Applications
10:30am - 12:15pm
MT
SESSION 10: Defense & Harsh Environment Applications
Defense and Harsh Environment Applications
10:30am - 12:15pm
MT
SESSION 9: Flexible Hybrid Electronics: Toward Scalable, Sustainable Systems
Session Chair:
Christine Kallmayer
– Fraunhofer - IZM
Flexible Hybrid Electronics
10:30am - 12:15pm
MT
SESSION 9: Flexible Hybrid Electronics: Toward Scalable, Sustainable Systems
Session Chair:
Christine Kallmayer
– Fraunhofer - IZM
Flexible Hybrid Electronics
10:35am - 10:55am
MT
The Value of Transparency for Automotive Heater & Antenna Applications: Identifying Product Market Fit
Speaker:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Flexible Hybrid Electronics
12:15pm - 1:45pm
MT
Networking Lunch
12:15pm - 1:45pm
MT
Networking Lunch
Location: Exhibit Hall
Networking
1:45pm - 3:10pm
MT
SESSION 11: Connected Health & Human Performance: The Future of Wearable Medical Technologies & IoT Integration
Wearable + Medical Electronics
1:45pm - 3:10pm
MT
SESSION 11: Connected Health & Human Performance: The Future of Wearable Medical Technologies & IoT Integration
Wearable + Medical Electronics
1:50pm - 2:10pm
MT
SESSION 11: Biowear TBA
Speaker:
Ronen Polsky
– Biowear
Wearable & Medical Electronics
2:10pm - 2:30pm
MT
SESSION 11: Advanced Flexible Wearable Sensors for Clinical Medicine, Military, and Digital Health Applications
Speaker:
Steve Xu
– Sibel Health
Wearable & Medical Electronics
2:30pm - 2:50pm
MT
SESSION 11: Next Generation, Wearable and Field-Deployable Sensors for Applications in Medicine, Environmental Monitoring, and Intelligence Gathering
Speaker:
Amay Bandodkar
– University of North Carolina
Wearable & Medical Electronics
1:45pm - 3:10pm
MT
SESSION 12: Advanced Packaging & Heterogeneous Integration
Advanced Packaging
1:45pm - 3:10pm
MT
SESSION 12: Advanced Packaging & Heterogeneous Integration
Advanced Packaging
1:50pm - 2:10pm
MT
SESSION 12: Intel TBA
Speaker:
Ravi Mahajan, PhD
– Intel
2:10pm - 2:30pm
MT
SESSION 12: Next Generation Advanced Packaging Challenges: Consumer vs. Data Center
Speaker:
E. Jan Vardaman
– TechSearch International, Inc.
3:10pm - 4:00pm
MT
Networking Break
3:10pm - 4:00pm
MT
Networking Break
Networking
4:00pm - 5:30pm
MT
SESSION 13: Printed Electronics
Session Chair:
Felippe Pavinatto
– GE Aerospace
Printed Electronics
4:00pm - 5:30pm
MT
SESSION 13: Printed Electronics
Session Chair:
Felippe Pavinatto
– GE Aerospace
Printed Electronics
4:05pm - 4:25pm
MT
SESSION 13: University of Washington TBA
Speaker:
J. Devin MacKenzie
– University of Washington
Printed Electronics
4:25pm - 4:45pm
MT
SESSION 13: Establishing Novel Thick- and Ultra-Thin-Film Flexible Printed Circuits via Additive Inkjet & Electroplating: Elephantech’s Breakthrough in SustainaCircuits™
Speaker:
Nobuhiko Okamoto
– Elephantech Inc
Printed Electronics
4:45pm - 5:05pm
MT
SESSION 13: Holst Centre TBA
Speaker:
Hylke B. Akkerman
– Holst Centre
Printed Electronics
4:00pm - 5:30pm
MT
SESSION 14: Energy Storage & Efficiency
Energy Storage & Efficiency
4:00pm - 5:30pm
MT
SESSION 14: Energy Storage & Efficiency
Energy Storage & Efficiency
4:05pm - 4:25pm
MT
SESSION 14: University of Wisconsin Madison TBA
Speaker:
Umit Ogras
– University of Wisconsin–Madison
