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Thursday, February 26, 2026
7:00am - 8:00am
MT
Breakfast
7:00am - 8:00am
MT
Continental Breakfast
Location: Sachem Terrace
7:00am - 1:45pm
MT
Registration
7:00am - 1:45pm
MT
Registration
Location: Wigwam Foyer
8:00am - 9:45am
MT
SESSION 8: KEYNOTES – General Session
Session Chair:
Gity Samadi
– SEMI
Session Chair:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Keynote
8:00am - 9:45am
MT
SESSION 8: KEYNOTES – General Session
Location: Hopi
Session Chair:
Gity Samadi
– SEMI
Session Chair:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Keynote
8:00am - 8:10am
MT
Opening Remarks
Location: Hopi
Session Chair:
Gity Samadi
– SEMI
Session Chair:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Keynote
8:10am - 8:40am
MT
Flexible ePaper Displays: From University Research to Global Corporation
Location: Hopi
Keynote Speaker:
Michael D. McCreary, PhD
– E Ink
Keynote
8:40am - 9:10am
MT
Wearable Microfluidic Systems for Personalized Hydration and Health Management
Location: Hopi
Keynote Speaker:
Roozbeh Ghaffari
– Epicore Biosystems, Inc.
Keynote
9:40am - 9:45am
MT
Closing Remarks
Location: Hopi
Session Chair:
Gity Samadi
– SEMI
Session Chair:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Keynote
9:45am - 10:30am
MT
Networking Break
9:45am - 10:30am
MT
Networking Break
Location: Wigwam Foyer
Networking
10:30am - 12:15pm
MT
SESSION 9: Flexible Hybrid Electronics: Toward Scalable, Sustainable Systems
Session Chair:
Christine Kallmayer
– Fraunhofer - IZM
Flexible Hybrid Electronics
10:30am - 12:15pm
MT
SESSION 9: Flexible Hybrid Electronics: Toward Scalable, Sustainable Systems
Location: Hopi
Session Chair:
Christine Kallmayer
– Fraunhofer - IZM
Flexible Hybrid Electronics
10:35am - 10:55am
MT
The Value of Transparency for Automotive Heater & Antenna Applications: Identifying Product Market Fit
Location: Hopi
Speaker:
Robert F. Praino, Jr.
– Chasm Advanced Materials Inc
Flexible Hybrid Electronics
10:55am - 11:15am
MT
Failure Mechanics of FHE Circuits under Sustained Temperature and Stresses of Daily Motion
Location: Hopi
Speaker:
Pradeep Lall
– Auburn University
Flexible Hybrid Electronics
11:15am - 11:35am
MT
High Resolution, Multi-layered Screen-printing of Stretchable Circuitry with ELMNT Liquid Metal
Location: Hopi
Speaker:
Jack T. Ly
– BlueHalo, an AV company
Flexible Hybrid Electronics
11:35am - 11:55am
MT
Investigating Organic Thin-Film Transistors for Particulate Matter (PM) Sensing Applications
Location: Hopi
Speaker:
Wudyalew Wondmagegn
– The College of New Jersey
Flexible Hybrid Electronics
11:55am - 12:15pm
MT
Tekscan’s Flexible, Sensorized Tactical Glove: Positioning of Bend and Applied Force
Location: Hopi
Speaker:
Casey J. Grenier, Ph. D.
– Tekscan, Inc
Flexible Hybrid Electronics
10:30am - 12:15pm
MT
SESSION 10: Defense & Harsh Environment Applications
Session Chair:
Andres Bujanda
Defense and Harsh Environment Applications
10:30am - 12:15pm
MT
SESSION 10: Defense & Harsh Environment Applications
Location: Aztec
Session Chair:
Andres Bujanda
Defense and Harsh Environment Applications
10:35am - 10:55am
MT
Low Swap_C Additively Packaged MEMS IMU
Location: Aztec
Speaker:
David Lin
– GE Aerospace Research
Defense and Harsh Environment Applications
10:55am - 11:15am
MT
Additively Manufactured Packages for Harsh Environment Electronics
Location: Aztec
Speaker:
Michael S. Kranz
– EngeniusMicro, LLC
Defense and Harsh Environment Applications
11:15am - 11:35am
MT
Novel Ink Development, Characterization, and Tests for Harsh Environments
Location: Aztec
Speaker:
Richard L. Fink
– Applied Nanotech Inc.
Defense and Harsh Environment Applications
11:35am - 11:55am
MT
Advances in EIT Sensor Systems for Non-Destructive Testing with Soft Robots
Location: Aztec
Speaker:
Madhu Stemmermann
– SunRay Scientific Inc.
Defense and Harsh Environment Applications
11:55am - 12:15pm
MT
Advanced Materials and Flexible Hybrid Electronics for Harsh Environments
Location: Aztec
Speaker:
Shenqiang (Shen) Ren
– University of Maryland College Park
Defense and Harsh Environment Applications
12:15pm - 1:45pm
MT
Networking Lunch
12:15pm - 1:45pm
MT
Networking Lunch
Location: Sachem Terrace
Networking
1:45pm - 3:10pm
MT
SESSION 11: Connected Health & Human Performance: The Future of Wearable Medical Technologies & IoT Integration
Session Chair:
Stephaney Shanks
– AV, Inc.
Session Chair:
Simon Dodd
– STMicroelectronics
Wearable + Medical Electronics
1:45pm - 3:10pm
MT
SESSION 11: Connected Health & Human Performance: The Future of Wearable Medical Technologies & IoT Integration
Location: Hopi
Session Chair:
Stephaney Shanks
– AV, Inc.
Session Chair:
Simon Dodd
– STMicroelectronics
Wearable + Medical Electronics
1:50pm - 2:10pm
MT
Microneedle-Based Wearable Biosensing for Advanced Physiological Monitoring
Location: Hopi
Speaker:
Ronen Polsky
– Biowear
Wearable & Medical Electronics
2:10pm - 2:30pm
MT
Advanced Flexible Wearable Sensors for Clinical Medicine, Military, and Digital Health Applications
Location: Hopi
Speaker:
Steve Xu
– Sibel Health
Wearable & Medical Electronics
2:30pm - 2:50pm
MT
Next Generation, Wearable and Field-Deployable Sensors for Applications in Medicine, Environmental Monitoring, and Intelligence Gathering
Location: Hopi
Speaker:
Amay J. Bandodkar
– North Carolina State University
Wearable & Medical Electronics
2:50pm - 3:10pm
MT
Wearable Ultrasound Technology
Location: Hopi
Speaker:
Sheng Xu
– Stanford University
Wearable & Medical Electronics
1:45pm - 3:10pm
MT
SESSION 12: Advanced Packaging & Heterogeneous Integration
Session Chair:
Mark D. Poliks
– Binghamton University, State University of New York
Advanced Packaging
1:45pm - 3:10pm
MT
SESSION 12: Advanced Packaging & Heterogeneous Integration
Location: Aztec
Session Chair:
Mark D. Poliks
– Binghamton University, State University of New York
Advanced Packaging
1:50pm - 2:10pm
MT
SESSION 12: Intel TBA
Location: Aztec
Speaker:
Ravi Mahajan, PhD
– Intel
Advanced Packaging
2:10pm - 2:30pm
MT
Next Generation Advanced Packaging Challenges: Consumer vs. Data Center
Location: Aztec
Speaker:
E. Jan Vardaman
– TechSearch International, Inc.
Advanced Packaging
2:30pm - 2:50pm
MT
Process Planning Approach for Hybrid Additive Manufacturing of Complex 3D Structural Electronics
Location: Aztec
Speaker:
Ashish Jacob, n/a
– The Pennsylvania State University
Advanced Packaging
2:50pm - 3:10pm
MT
Indium Bump Interconnect (IBI) Flip Chip Bonding
Location: Aztec
Speaker:
Dmitry Padrubny
– Finetech USA
Advanced Packaging
3:10pm - 4:00pm
MT
Networking Break
3:10pm - 4:00pm
MT
Networking Break
Location: Wigwam Foyer
Networking
4:00pm - 5:30pm
MT
SESSION 13: Printed Electronics
Session Chair:
Felippe Pavinatto
– GE Aerospace
Printed Electronics
4:00pm - 5:30pm
MT
SESSION 13: Printed Electronics
Location: Hopi
Session Chair:
Felippe Pavinatto
– GE Aerospace
Printed Electronics
4:05pm - 4:25pm
MT
SESSION 13: University of Washington TBA
Location: Hopi
Speaker:
J. Devin MacKenzie
– University of Washington
Printed Electronics
4:25pm - 4:45pm
MT
Establishing Novel Thick- and Ultra-Thin-Film Flexible Printed Circuits via Additive Inkjet & Electroplating: Elephantech’s Breakthrough in SustainaCircuits™
Location: Hopi
Speaker:
Nobuhiko Okamoto
– Elephantech Inc
Printed Electronics
4:45pm - 5:05pm
MT
Additive Manufacturing Technologies for Next Generation Microelectronics and Packaging
Location: Hopi
Speaker:
Hylke B. Akkerman
– Holst Centre / TNO
Printed Electronics
5:05pm - 5:25pm
MT
Inkless and AI-Enabled Additive Nanomanufacturing of Functional Materials and Devices
Location: Hopi
Speaker:
Masoud Mahjouri-Samani
– NanoPrintek, Inc.
Printed Electronics
5:25pm - 5:30pm
MT
Conference Closing
Location: Hopi
Session Chair:
Felippe Pavinatto
– GE Aerospace
Printed Electronics
4:00pm - 5:30pm
MT
SESSION 14: Energy Storage & Efficiency
Session Chair:
Dylan Shah
– Arieca
Energy Storage & Efficiency
4:00pm - 5:30pm
MT
SESSION 14: Energy Storage & Efficiency
Location: Aztec
Session Chair:
Dylan Shah
– Arieca
Energy Storage & Efficiency
4:05pm - 4:25pm
MT
How Much Energy Can Wearables Harvest Per Day? A Data-Driven Analysis with Flexible Multi-Modal Harvesters
Location: Aztec
Speaker:
Umit Ogras
– University of Wisconsin–Madison
Energy Storage & Efficiency
4:25pm - 4:45pm
MT
Design Principles for Flexible Power Sources
Location: Aztec
Speaker:
Candace K. Chan
– Arizona State University
Energy Storage & Efficiency
4:45pm - 5:05pm
MT
Low-Power ZnON Thin-Film Transistors for Neuromorphic-Photodetector Switching with PCB Integration
Location: Aztec
Speaker:
Won Woo Lee
– Hanyang University
Energy Storage & Efficiency
5:05pm - 5:25pm
MT
Plan to be Wrong: A Case Study in Scaling Flexible Photovoltaics
Location: Aztec
Speaker:
Richard Swartwout
– Active Surfaces Inc.
Energy Storage & Efficiency
5:25pm - 5:30pm
MT
Conference Closing
Location: Aztec
Session Chair:
Dylan Shah
– Arieca
Energy Storage & Efficiency
